Microstructures and Electrical Resistivity of Aluminum–Copper Joints
نویسندگان
چکیده
Using pulsed double electrode-gas metal arc welding, aluminum wires are joined to copper plates with fillers of different fractions silicon. Two layers microstructures formed near the Al-Cu interface: one consists a hypoeutectic microstructure α (Al) + Al2Cu, and other an intermetallic compound (IMC) Al2Cu. Increasing heat input causes increases in thicknesses IMC layer microstructure. Si suppresses growth assists The effects interface chemical compositions on electric resistivity joints analyzed. increase law mixture is used calculate joints, which accordance experimental results.
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ژورنال
عنوان ژورنال: Metals
سال: 2023
ISSN: ['2075-4701']
DOI: https://doi.org/10.3390/met13081474